Mobile IC Package Recognition
نویسندگان
چکیده
This paper describes an image processing system that detects integrated circuits (ICs) in an image of a printed circuit board (PCB) and attempts to read the part label and identify the chip using optical character recognition (OCR). A prototype of the system was built using an Apple iPhone to acquire the images and display the results while a remote server running MATLAB performed the processing.
منابع مشابه
Modelling Solder Joint Reliability of Bga Packages Subject to Drop Impact Loading Using Submodelling
With the trend towards miniaturization and multi-functionality in products such as mobile electronic devices, miniature IC packaging such as fine pitch Ball Grid Array (BGA) package and Chip Size Package (CSP) are increasingly being used. However, the inherent vulnerability of these miniature IC packagings has brought along new reliability problems. Among them, the drop/impact robustness is the...
متن کاملRF SiP Technology: Integration and Innovation
With the continued demand for electronic systems and subsystems with more functionality, higher performance, smaller size and lower cost, system-in-package (SiP) modules have been growing rapidly in recent years as an alternative solution to system-on-chip (SoC). As a packaging technology platform, SiP allows a high degree of flexibility in the package architecture, particularly for radio frequ...
متن کاملA Compact Multilayer IC Package Model for Efficient Simulation, Analysis, and Design of High-Performance VLSI Circuits
A multilayered integrated circuit (IC) package structure is composed of many signal layers, power layers, and ground layers. Particularly, the whole planes are assigned for the power and ground of the system. Accordingly, the generic circuit representation of such a complicated multilayer IC package becomes too complicated to efficiently evaluate its electrical performance. In this work, a nove...
متن کاملGeorgia Tech Consortium on Integrated Approach to Power Delivery for Electronic Systems
Moore’s law has been the driver for the semiconductor industry for more than four decades which has led to phenomenal transistor density within the chip, as shown in Figure 1. Since the mid-1990s, with the emergence of mobile phones and other consumer devices, package level integration has increased significantly as well. Sometimes referred to as More than Moore integration, these advances have...
متن کاملFully integrated UHF RFID mobile reader with power amplifiers using System-in-Package (SiP)
A fully integrated system-in-package (SiP) for UHF (860– 960MHz) RFID mobile reader is presented. The SiP is made up of an UHF transceiver, a power amplifier (PA), and two baluns. The UHF transceiver was designed in TSMC 0.18μm Si CMOS and the PA was developed with InGaP/GaAs hetero-junction-bipolar transistor (HBT) technology. The transceiver IC is fully integrated for mobile UHF RFID applicat...
متن کامل